Dry micromachining for high aspect ratio microsensors and optical switches in silicon

Precise dry micromachining technologies have been developed in an electron cyclotron resonance (ECR) plasma source for the fabrication of high aspect ratio microstructures in polyimide, Ni, ceramic, and single crystalline Si with fast etch rate, high selectivity, vertical sidewall profile, and smooth surface morphology. These high aspect ratio elements are crucial for high performance micro-electromechanical systems.;Various micromachined transducers were fabricated by etching with the ECR source. High aspect ratio polyimide was etched in an O;Optical switches consisting of arrays of vertical Si micromirrors were designed and fabricated by the deep etch-shallow diffusion process. These 50-...