Application Of Laser Scattering Method In Inner Stress Measurement Of Transparent Board-shell Models

Transparent material such as plexiglass is commonly used in aviation, spaceflight, building construction, electronic industry and motorcar industry. So it is of great significance to study the measuring of its initial stress, processing stress and stress under different kinds of load to eliminate the danger to its structure and make sure its intensity and safety. In this paper we find that laser scattering method is the best option to measure the stress of transparent material and has many unsubstitutable advantages such as non-destructive, simple equipment, with clear strip and complete stress information after our summarization and research on different optical methods.In this paper, we developed a new means of laser scattering method—slanting incidence after theory deduction and experimental tests. Besides,we introduced a beam-of-light coupling to make the laser beam successfully rip into the material. In addition, we improved the precision and adaptation of the method by using the first reflex beam of the slanting incidence light to get the clearer and more complete strip images. Afterwards, we systemically analyzed the initial stress and processing stress of the transparent bending boards that commonly exist in engineering projects by steps that from simple to complicated mechanical model and from single to multiple means. Through comparing of measuring values and theoretical values, we validated the measuring precision of vertical incidence and slanting incidence and also the application foreground in engineering projects of this method.To complete every step of the work said above, we systemically studied the image-taking and image-process techniques and completed the whole programming work that formed a integrated software system.