Electroless Copper On Ceramics And Study Of Characteristics Of The Solution/Corrosion Under Organic Films

There抮e two parts in this paper Part(I) is about the research of electroless copper plating on ceramics and of the characteristics of the solution Corrosion under organic films was investigated in part(II) Based on the importance of electronic industries , metalization on ceramics becomes more and more extensive . However , the investigation is focused on technology . Little work is being done on )he plating mechanism and the function of the ingredients of the solution . The first part of this paper explored deposition progress and the function of the formaldehyde and additives . The second part demonstrated the feasibility of studying the corrosion under organic films with classic electrochemical methods . If possible, we could avoid the time-wasting or expensive electrochemical methods to research some corrosion. 1. Electroless copper plating on ceramic: The rate of electroless copper plating on ceramic was calculated by methods of average thickness and increased mass. The influence of temperature ,time and additives on the rates, the appearance of the deposits and the stability of the solution was investigated - Action energies were worked out according to empirical rate laws. Crystal structure and surface morphology of electroless copper films deposited from solutions containing additives and for different times were investigated by X-ray diffraction (XRD) and electron microscope observations (SEM). Both patassium hexacyanoferrate(II) and a,a?bipyridyl affected activation energy and kinetic coefficient .They increased ~ctivation energy and decreased deposition rate ,but improved the quality of the deposits and the stability of the solution .SEM showed electroless copper films deposited from solutions containing additives were more uniformity and lubricous than that deposited from solutions without additives. And a,a?bipyridyl performed better than patassium hexacyanoferrate(II).The intensities of XRD decreased by implanting the patassium hexacyanoferrate(JI) and a,a?bipyridyl, and the diffraction of Cu20 weakened or vanished. When the solutions contained patassium hexacyanoferrate(II) or not ,the TC values of the reflection planes were close, which indicated the copper crystal grain growed in disorders. The solutions containing a,a?bipyridyl favoured the reflection planes(220) coming to being, that is, a,a?bipyridyl was prone to adsorbed on the (220) plane, which made the (220) plane the remained reflection planes. 2. Characteristics of electroless copper solution: The behaviors of formaldehyde were investigated by cyclic voltammogram and 3 potentiostatic polarization. AC Impedance technique was used to study the impedance of different pH and different additives. The study showed the oxidation of formaldehyde and the reduction of Cu(II) were accelerated mutually. It might be that the active Cu(lI)-EDTA-formaldehyde was formed .When patassium hexacyanoferrate(II) or a,a?bipyridyl existed with formaldehyde ,the polarization mainly embodied the characteristics ~f formaldehyde . a,a?bipyridyl showed the same characteristics as formaldehyde, which indicated that a,a?bipyridyl and Cu(II) can also form an active compound like Cu(II)-EDTA-formaldehyde. The influence of patassium hexacyanoferrate(II) and a,a?bipyridyl on the impedance indicated that additives inhibited deposition rates mainly by adsorption in low concentration or by complexation in high concentration. 3. Corrosion under organic films...