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Optimization Of Electroless Plating Ni-P Alloy Technology On The Surface Of Brass Substrate

Posted on:2003-04-02Degree:MasterType:Thesis
Country:ChinaCandidate:D L HuFull Text:PDF
GTID:2121360092465960Subject:Metallurgical engineering
Abstract/Summary:PDF Full Text Request
Electroless plating nickel is a kind of electroless deposition process with extensiveaPplicaton. ComPallng with electro-dePositon process, the process has a lot ofadvamages, such as easy operation, low process condition, uniform eleCtroless platingfilm. So the research and development of electroless plating nickel have greatsignificance.Before nickel film is deposited by electroless plating, the sdse of coPPer and brasssubstrate need be induced. ComPared with different inducing methods by lots ofexPeriments, a simPle and effective inducing method is confirmed, the OPimaltechnological conditions and formula about the soluton of electroless deposition Ni-Palloy are also obtaned. The influence of different technological parameters on thedePosition rate is stUdied. Analyzed the pefformance of Ni-P alloy on the differensubstfates and its corresponding trictUre, the result is shown tha the eleCtroless platingnickel process can obtained the Ni-P alloy film having brightuess-integrity sdse, strongbinding energy and high rigidity At the temPeratUr about 350wt00oC, the electrolessplating nickel film would trallsform from amorphous tO crystal State. Whn the H2PO3-concentration in solution measures uP to the degree of influencing the plating nickel filmquality the solution of electroless plating nickel need be replaced.FWrmore, the electfOless plating mechAnsm is discussed. The proper atOmic clustCrmodel is develoPed in the paPeL According to calculating results of quantUIn chemiwtand the theory of Sanderson electro-negativity the law of electron distribuing in brassmaterial and the electtO-negativity of brass-zinc are established. The researching result isshown that an electron divided equally trend and an action of bond forming exist in brassatOm and zinc atOm in brass substTate. So, the electrO-negativity equilibrium Principledeveloped by Sanderson et al, may be extend to the system such as brass under differentconditions. The electro-negativity equilibrium was Produced during the process from purebrass and pure zinc to brass-zinc alloy, and the difference of chemical properties betWeenalloy and pure material is great. The electro-negativity equilibrium is not onlystrengthened the stability of brass material, but also imPeded zinc in brass material from. exuding in plating sollltion.The electroless plating nickel's reaction can take place in the active suthee of metal,The activity of the surface of metal lied on three factors, including the properties ofIlmetal's edce, the choice of reducer and the manner of action between reducer andmetal's sdse. In addition, the mode of M...H-R established by using fOr reference ofthe correlative principle of electroless plating nickel and the transition state theory abolltthe illterplay between reducer and metal's sche was also Stlldied in this paPer. Theresults of calculation and analysis by using this mode into the process of electrOlessplating nickel are shown that the theory was ttue of practice.
Keywords/Search Tags:brass substrate, electroless plating Ni-P alloy, activity, thermal treatment electronegativity
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