Structure, Curing Kinetics And Thermal Properties Of Boron-containing Bisphenol-F Formaldehyde Resin

Different phenols can be used to make boron-containing phenol-formaldehyde resins, in order to obtain better properties boron-containing phenol-formaldehyde resin. Boron-containing BisphenoI-F Formaldehyde Resin (BBPFFR) is one of them. In this paper, BBPFFR was synthesized by boric acid method and paraformaldehyde method. It's structures, curing kinetics and thermal properties were studied by FTIR, DSC and TGA.1. The structure of BBPFFR synthesized by the method of formalin and the thermal degradation process were studied. The results show that hexatomic ring containing coordinate linkage of boron-oxygen was formed in the thermosetting process, and the coordinated oxygen atom was offered by phenol hydroxyl. The degradation of this resin began with the oxidation and breakage of ether linkage and carbonyl group. The decomposition reaction of this resin can be divided into three stages, and in every stage the decomposition reaction follow first order.2. The curing progress of BBPFFR synthesized by the method of the paraformaldehyde was studied. The results showed hexatomic ring containing coordinate linkage of boron-oxygen was formed in the thermosetting process. The isothermal curing reaction was shown to follow autocatalytic kinetics mechanism and the curing reaction becomes controlled mainly by diffusion in the latter reaction stage, which can be well described by introduce a diffusion factor, f(a), to the model proposedby Kamal.3. During the progress of BBPFFR curing bisphenal-A epoxy resin, phenol hydroxyl, methylol and un-reacted -OH in boric acid were reacted with epoxy group. The isothermal curing reaction was shown to followautocatalytic kinetics mechanism. Compared with the plot of da I . t of BBPFFR, it is more short to get the most reaction rate. The decomposition reaction can be divided into three stages, and in every stage the decomposition reaction follow first order.