Study On The Bisphenol S Epoxy Resin And Its Derivatives

In this article, the synthesis, curing behavior and properties of the bisphenol S epoxy resin (DGEBS), bisphenol S epoxy vinyl resins and bisphenol S thiirane resion were studied systemically.At First, the DGEBS was successfully synthesized by three methods: One-step method with phase-transfer catalyst, two-step method with regular atmospheric pressure and two-step method with negative atmospheric pressure. The structure and properties of the resin were characterized by FT-IR,’H-NMR, ESI/MS, titration and DSC. The etherification process of bisphenol-S (BPS) and epichlorohydrin (ECH) was characterized by the FTIR method. The results showed that the reaction rate associates with the concentration of the phenolic hydroxyl when the ECH is greatly excessive. The various factors of the two-step method with regular atmospheric pressure was investigated by the orthogonal experiments. The study found that etherification catalyst and closed loop temperature was the main factor to affect the epoxy value and the yield of the resin. The DGEBS which synthesized by the regular atmospheric pressure had the epoxy value more than0.5, and the melting point was165℃, which is consistented with the report.In addition, the bisphenol-S epoxy vinyl resin was successfully synthesized by DGEBS and acrylic acid. The structure of the product was characterized by the FT-IR,’H-NMR and MS. The synthesis reaction was traced by the’H-NMR. The standard working curve to control the vinyl content was set up. The crystal structure of the bisphenol S vinyl resin which had0.5vinyl content was characterized by the POM and DSC. Crystalline state was found in the resin when the temperature below92.5℃.And then, the bisphenol-S thiirane resin was successfully systhesized by DGEBS and KSCN. The method to characterize the conversion rate of epoxy group was set up, and the various factors of the systhesis reaction was investigated. The structure of the resin was characterized by the FT-IR, and1H-NMR. The study found that the bisphenol-S thiirane resin had self-curing property, and the curing reaction order n=0.949. The bisphenol-S thiirane resin could not only be the hardener to curing the epoxy resion, but also could be the curing accelerator which could reduce the Ea of the curing reaction. And it had excellent heat resistance which equivalent to the DGEBS.