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Design And Research Of Ultrasonic Wire-bonding System For Al Wire-bonding Machine

Posted on:2006-08-14Degree:MasterType:Thesis
Country:ChinaCandidate:J WuFull Text:PDF
GTID:2121360152490426Subject:Detection Technology and Automation
Abstract/Summary:PDF Full Text Request
This paper lays emphasis up on the R&D of the computer measure and control system which is smart, systematical, smallsize and multi- functional. This instrument has such advantagesas high precision, high sensitionvity, multi-parameter setting and friendly interface. Perform ultrasonic wire bonding process control in ultrasonic wire bonder.This paper studys the principle of ultrasonic wire bonding and important process parameter signals characteristics, and describes a smart wire-bonding measure and control system design base on them. The CPU used in this system is TMS320LF2407A, The hardware and software are integrated to fulfill the following function: amplifing signal, filtering waves, converting analog signal to digital signal. Communication with RS-232 links up the master CPU and the save CPU. These make the system lower power consumption and higher reliability.The application software is base on Visual C++ under the windows.Data acquisition, Data storage, result display are programmed in subprocedure and allocated by main procedure. Instructsuperfluons and software trap enhance the reliablity and ability of resisting—disturb of the system.At the same time, this paper tries to solve the problem how to use the advanced arithmetic into practice. And it uses the arithmetic of fuzzy control into practice and have tests. The result is satisfying.
Keywords/Search Tags:Measure and Control System, Ultrasonic wire bonding, Serial Communication, Resisting—disturb
PDF Full Text Request
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