Study On The Vibration Of Slicing Single Crystal Ingot By ID Saw

ID (inner diameter) slicing is an important process to produce wafers, it not only determinds quality and cost of the wafers, but affects the time of the lapping and the final quality of the IC. But there are few researchers who take on the early research about the production of wafers; especially there is less research for the process of ID slicing. This paper studies the influence rule of the blade's vibration and the surface roughness, warp, total thickness variation (TTV) of the wafers, study the abrasion form of the diamonds of the ID saw blade by scan electronic microscope (SEM), study the ID saw balde lifetime by tension and dressing.1. The paper studies in the number the reason of the blade's vibration. Because the characture of the slicing the vibration must take place. There are many reasons lead to the blade's vibration. The most important reasons are the variety of the slicing craft, the state of the blade, blade tension and the slicer configuration, at the same time the structure of the single crystal silicon is anisotropism which can lead to the blade vibaration too.2. The effect between vibration of the blade, its abrasion and the wafers' surface roughness, warp and TTV. Sample the radial and axial vibration of the blade, and carry on power cepstrum, frome a new ID saw blade slicing till to its invalidation; measure the wafers' surface roughness, warp and TTV, find out their variety rule. Analysis the effect of the wafers' surface roughness and its precision leading from the vibration of the blade.3. The effect of feed speed and the crystal diameter. Sample the radial and axial vibration of the blade, and carry on power cepstrum, measure the corresponding wafers' surface roughness, warp, TTV. Analysize the influence principal between the blade's vibration and the quality of wafers, and provide the rational slicing parameter.4. On the basis of slicing analysis, combine with scan electric microscope (SEM), observe the form of the dianmonds and analyze the abrasion of the ID saw blade. Study the influences of the vibration and lifetime of the blade leading from its tension and dressing.