Research The Key Technology Of Silicon Wafer's Grinding Device Based On Silicon Wafer Rotating

With faster developing of integrated circuit (IC) manufacturing technology, the diameter of silicon wafer tends to be larger. In manufacture of the next generation IC, some requirements for wafer, such as machining accuracy, surface roughness, surface defect, surface purity and strength, are proposed much higher. Ultra-precision grinding is considered as the most promising technology for processing the large-scale silicon wafer. Among the precision process methods, the wafer rotation grinding method is widely applied, which is used in both preparation of the blank wafer media and back thinning of the pattern wafer. However, at present, the advanced grinding technologies and equipments for wafer are monopolized by developed countries and multinational companies, so the development of semiconductor manufacturing technology and equipment in our country is severely confined.In this paper, the key technologies of silicon wafer grinding equipment are analyzed. The principle of vacuum chuck system, the dressing and testing of vacuum chuck, the principle and adjusting method of silicon wafer on-line test system, and the principle of the grinding force measuring, are introduced. Based on this, the overall structure of the test apparatus for silicon wafer grinding is designed. The grinding head spindle's structure and the adjusting device for the angle between the axes of spindle and the axes of rotary table are designed completely; The structure of spindle feeding device is designed, and through theoretical analysis, the feeding velocity range of the test apparatus is defined; The structure of the rotary table is designed, and the grinding table is manufactured, installed and debugged.In this paper, the grinding force measuring system is developed, and both the piezo-electic measuring system and the forces on rotary table are analyzed. The structure of three-dimensional piezo-electic quartz force cell plate is designed. The installment and debugging of this system are finished. Force experimentation is done with the computer control system and the software of grinding forces measuring system.This paper explores on development and design of semiconductor silicon wafer Ultra-precision grinding equipment, and provides the technique for subsequent research. According to the development of national semiconductor manufacture industry, it has important practical value.