The Technology Of Electroless Copper Plating On Wood And The Copper Layer's Characteristics

With the shining cooper on the surface, wood will appear beautiful grains that have the luster of copper. If the copper is adhered on the wood surface, the surface will have the physical ability of the copper, thereby we could cover more metal on wood surface by more common metal-plating technologies and make the wood surface appear various metal effect. The purpose of this study is to develop electroless copper plating technology which is especially used on the wood surface. In addition, electroless copper plating was analysed to judge its physical character and how it is distributed on the wood surface.Research results are summed up as follows:1. An electroless copper plating technology has been developed. It includes pretreatment means, prescription of plating liquid and processing craft. This processing craft could be used on different wood, so it has good adaptability. The best description of the plating liquid is composed of copper-salt (8g/L), complex (20g/L) and HCHO (10ml/L). The temperature should better be kept by 50℃ and pH is between 12.4 and 13.2. The thickness of copper layer could be adjusted by means of changing plating time. More time is used, more copper is plated, but when plating time is over the limit, the thickness of copper layer will not increase. In addition, according to the trend of relationship between thickness of copper layer and plating time of seven species, the thickness of copper layer increase fastest in the first 10 minutes.3. With the increasing of the thickness of copper layer, the electric ability of the surface is also improved and the exterior resistivity of different surface is also more identical. When the thickness of copper layer is over some value, the electric ability of wood surface is close to that of copper foil and the adhesive intensity is also been improved.4. According to the images of XRD, the copper layer will have great pure degree and the character of it will be close to copper toil if using this craft.5. According to the graph of SEM, the grains on wood surface is main factor that affect the electric ability and the adhesive intensity of copper layer on wood, which could beresolved by increasing plating time.