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Research On The Ultra Precess Precessing Technology Of Ultra Rigid And Crisp Material

Posted on:2007-04-04Degree:MasterType:Thesis
Country:ChinaCandidate:W ZhaoFull Text:PDF
GTID:2121360182485349Subject:Mechanical Manufacturing and Automation
Abstract/Summary:PDF Full Text Request
At present, along with the modern high-tech development, the hard crisp material (for example project ceramics, optical glass, semiconductor, monocrystalline silicon, sapphire and quartz crystal and so on) are application more and more widespread in electronic, optics, the instrument measuring appliance, aerospace and civil profession and so on. The hard crisp material processing mainly uses the grinds polishes technology, but the grinds polishes technology production cycle is long and the product cost is high. In recent years, along with the progress of ultra-precision grinding technical, the surface quality of grinding equates even surpasses the surface of grinds polishes, and processing efficiency large-scale enhancement. If milling can be used to replace thick, precision grinding, by way of front working procedure of the ultra-precision grinding and ultra-precision grinds polishes, then can greatly reduce the cost and enhances the productivity. But at present the study to the ultra-precision milling also only is the pause in the preliminary stage, therefore develops the study of ultra-precision milling mechanism and milling technical has the important theory significance and the use value.1.In the aspect of modeling of mill force: base on the analysis of characteristics of ultra-precision milling and the material quality characteristic of hard crisp material itself, analyzed the tradition model of cutting force, initially established the model of ultra hard crisp material order tooth milling force, built the foundation for further the research.2. In the aspect of experiment study: a series of experiment in the processing center to the hard crisp material (aluminum oxide ceramics, zirconium oxide ceramics, nitrided silicon ceramics, monocrystalline silicon) has been carried out using diamond mill cutter which is designed by writer, through analysis surface roughness and the change of chip drew the following conclusion:(1) The change of milling parameter direct influence superficial appearance, chooses the reasonable milling parameter may obtain the high grade superficial appearance.(2) From analysis the processing chip which collects from experiment knows: Thevariation of the milling parameters has little affection on the variation of the shape parameters of chipping, which is mainly determined by the material crystal parameters.(3) Using the experimental result inferred the hard crisp material milling surface roughness forecast model, and conducted the simulation research. Passed through analysis the simulation data and the experiment data, conform the accuracy of the forecast model.
Keywords/Search Tags:hard crisp material, ultra-precision milling, surface roughness, simulation, chip
PDF Full Text Request
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