Research On Temperature And Stress Field Of Silicon Steel

As computer technology keep developing, computer simulation technology are applied wider and wider in steel production field. Building a temperature and stress field foretell model of hot-rolled silicon steel has become an important segment for improving production quality and increase manufacture efficiency. In this paper real process of silicon steel hot rolling product line is taken as research object, which temperature and stress field foretell models are built for. A software called crack prediction system is developed with VC program language. Moreover, CCT curves of silicon steel are measured.Follow contents are included in this paper:(1) Temperature field testing: samples are made and temperature field measuring are conducted according in principle of geometry similitude, based on practice of silicon steel production, temperature both on surface and inside are collected.(2) Models for temperature field simulation are built: considering case that thermal parameters vary with temperature thermal parameters measures are conducted. According to product practice, considering thermal conduct, convection and radiation a FEM prediction model for silicon steel air-cooling is built. Software can calls ANSYS programs directly in interface and data can communicate between VC and ANSYS is developeded with VC.(3) Models for temperature field simulation during handling are built: a temperature field simulation is conducted base on condition in manufacture that a kind of black stamp appeares in position of grip blocks which will affect quality of finial products. Temperature field pictures at different moments are obtained and temperature-time curves on different points. The results of simulation is useful for improve technics of manufacture.(4) Models for stress field simulation are built: Stress-Strain curves and resistance of deformation-temperature curve are measured. And a stress prediction FEM model for silicon steel air-cooling is built applies elasto-plastic mechanics method. Getting some stress field pictures at different moments and stress-time curves on different points which provide important data for solving crack problem during transfer.(5) CCT curve of silicon steel are measured: introduce measurement of CCT curve and factors affect CCT curve.