A Study On Deposition Process In Cathodic Arc Ion Plating Through Computer Simulation

Cathodic arc ion plating (CAIP) has been widely applied in modern technology field. The deposition process of thin film has been thoroughly studied in terms of theories and experiments. With the improvement of computer technology and the understanding of physical process for plating, the deposition process in cathodic arc ion plating through computer simulation is a very efficient method for material research.The intuitionistic simulation results of deposition process in cathodic arc ion plating by computer are summarized in the paper.First of all, a set of physical models of plating process are set up, including the model of macroscopical evaporation, the model of microcosmic evaporation, the model of bias voltage electric field, the model of movement and the model of adsorption . They accord with the real plating process in vacuum chamber.Secondly, some mathematic models are set up. Typical vacuum chamber for CAIP is regarded as a circular cylinder in shape. The surface of the internal small one represents the substrate or coating. The two bases and lateral surface serve as the anode, while the axis and substrate for plating serve as cathode. The electric voltage is supplied between the anode and the cathode. The plasma, which evaporates out of the surface of the alloy target, will be accelerated in the field. To begin with, the bias electricl field strength is calculated.The field strength distribution is obtained inρand z directions under the role of two bases, lateral surface and the substrate respectively. And the field strength is depicted from the charge q to the voltage u. In addition, the force analysises in the electric field and their displacements and velocities are obtained. At last the tracks of particles charged in the electric field are simulated. Thus the models have been set up on the feasible hypotheses. The formulas above are precise through repeated tests.Finally we use the software VC++ and compile programs to simulate the deposition process on the basis of mathematic models.Based on a rational approximation , the bias voltage electric field in cylinder-like vacuum chamber is simulated, the relation between strength of electric field and coordinates ofρand z has been indicated by graph, incepted screen in symmetry has been designed, the...