Heat Treatment And Properties Of SiCp/Al Composites With Complex Shape

With the development of VLSI, there will be more demanding requirements for the electronic packaging technology. To meet the requirements, developing new electronic packaging materials is a must. SiCp/AI composites have been receiving much attention in recent years because of its high thermal conduction, low coefficient of thermal expansion, low density, high specific stiffness, high specific strength.In this paper, the effects of heat treatment and densification on the propreties of SiCp/AI composite with complex shape. The composites were fabricated with the technology of hot injection moulding.After mixing glycerol, paraffin wax, stearic acid with proper proportion to form a mixture, then mix the mixture with SiC with the ratio of 1:6, and at last inject the latter mixture in the module to form complicated perform. The preform is consisted by two different SiC particules and their average diameters are 5μm and 45μm. The volume fraction of the preform is 67.5%.Dewaxing and sintering of preform must abide by a proper rule. Rate of temperature rise has a right range. If the rate is faster, the preform will crack; while the rate is slower, the efficiency of production will be lower.Densification and heat treatment have great effects on the mechanical properties of SiCp/AI composite with complex shape which is fabricated by pressureless infiltration. When the Densification varies from 95.5% to 98.7%, the bending modulus will increase from 109GPa to 136GPa. After that, the bending modulus doesn't increase any more. This phenomenon shows that when the densification is large enough, the delivery of load from the Al matrix to SiC isn't impeded by the hole. At the same time, Densification has great effect on the strength of SiCp/AI composites. Heat treatment has little effect on the bending modulus, while it has great effect on the strength. The result is as follows: T6 > as-cast> as-aged>as-annealed.Likewise, Densification and heat treatment have great effects on the physical properties of SiCp/AI composites. When the Densification is higher, the CTE of the composite is higher also. This is because that the compressive stress around the holes...