Properties Of Epoxy Encapsulating Materials

With the development of electrical industry, high-performanceencapsulating materials were required. It is one of the most improtantprojects to look for a kind of encapsulating materials and research thenew methods of preparing it. Epoxy resins adhesive have attractiveproperties such as low shrinkage during curing, solvent and chemicalresistance, good mechanical and electrical properties, and high adhesivestrength, which has been widely used in electronic device manufacturing.In this paper, the properties of epoxy encapsulating materials isstudied, and a colorless and transparent epoxy resin, modified curingagent were chose as the main materials to prepare the solar cellencapsulating materials. Synergistic effect of curing agents is studied,and the effect of component on the mechanical properties of encapsulatingadhesive is discussed, what is more, theeffectofsynergistic effect andcontent on the optical performance of encapsulating adhesive is discussed.The results showed that mixed with different curing agents and synergisticeffect was occurred, which enhanced the properties of orginal curingagents greatly, and the reactivity of curing reaction is affected bysynergistic effect of curing agents. The synergistic effect of curingagents is better when D-230:IPDA=5:3, and the fracture strength ofcompound is maximum, it's 150.95Mpa; The gel time was measured underdifferent temperatures, and according to the Arrenhinus formula, theapparent activation energy can be calculated by dealing with the linearcurve fitting, and the temperature sensitivity and reactivity of reactionis discussed, the apparent activation energy of D-230+IPDA is41.93KJ. mol^-1, the extent of reaction under certain temperature is fairlygood, and the properties of compound is also improved.In this paper, the effect of component on the mechanical and theoptical properties of compound is studied. An active diluents was used to decrease the viscosity and to enhance the operating characteristicswithout damaging activity of composition. The fracture strength ofcompound is maximum, when the content of diluents 501 is 15phr. Benzylalcohol and epoxy resin has good compatibility, which can promote theepoxy-amine reactions, and the fracture strength ofcompound is much highwhen the content of benzyl alcohol is 5phr. What is more, when the contentof plasticizer is over 10phr, the fracture strength of compound decreasedsignificantly. And with the reaction temperature rised, the mechanicalproperties of compound is improved, but there is a optimal temperatureof reaction, the results showed that the optimal temperature is 80^C andthe reaction time is 1.5 hours.The concentrator efficiency and service life of solar cell are affecteddirectly by the transparency and weather resisting property ofencapsulating materials. And the influencing factors of epoxyencapsulating materials transparency is discussed. Alicyclic curingagent with high transparency as IPDA, N-AEP is chose to mixed, andsynergistic effect is occurred, which is better than the effect of singlecuring agent like D-230, and the transparency of compound is improvedeffectively, meanwhile it has goodresistance to ultraviolet capability.The optical performance of compound is decreased when the content ofdiluent 501 is over 15phr, which is consistent with the mechanicalperformance. What's more, the mechanical and the optical performance ofcompound is decreased when the content of plasticizer is over 10phr.