The Preparation And Property Research Of Epoxy Resin Based Electric Electronic Packaging Material

Epoxy resin is heat cured resin of good adhesive, mechanical strength, insulation. So it is widely used as casting material or packaging material of electric electronic apparatus. Four parts of research were did in this thesis: First, the choice of resin, curing agent and aid agent of the packaging material; Second, the preparation of epoxy/silicon powder packaging material; Third, the epoxy resin/nano-silicon composed material was prepared;forth,qualities of the two material's are compared with each other.The basic resin, curing agent and aid agent was selected. Low molecular weight liquid bisphenol A epoxy resin was selected as the best basic resin and anhydrideχand imidazole was selected as curing agent. This material has a good heat-resistant , good manufacturing technics and short curing time. Butyl glycidylether can be selected as thinner agent on actual need.Different direct blending time is studied at the same time different silicon powder and its'dosage are also investigated. According these research: if the blending time is long, the material will be black and it's electricity quality will become cracking. The material added with active silicon powder has better integrate quality than added with common silicon.A new way- in situ create and polymerization-is employed to make the epoxy resin/nano-silicon packaging material. According this way, the nano-silicon particles are composed directly to epoxy resin before its'reuniting. The manufacturing technics and nano-silicon's surface modification are studied. In addition to this, the effects of the nano-silicon's content to the material's qualities is investigated. The material obtained from in situ create and polymerization has better mechanic capability and particle dispersion than the material obtained from direct blending. With the increasing of the taking out tempreture the nano-silicon reunite graveness, but adding the Silane coupling agents can reduce the reuniting. The mechanic capability and breakdown voltage become first increased and then declined with the increasing content of nano-SiO₂, and the highest is on the nano-silicon's content 4%～6%. But the material's tanδandεr are becoming bigger with the increasing content of nano-silicon. When comparing the two packaging material some points was founded:The epoxy/silicon powder electric packaging material'has better integrate mechanic performance, higher breakdown voltage, larger tanδand largerεr. Keeping other qualities good, the best adding content of silicon powder and nano-SiO₂ were decided. At this content the viscidity of epoxy resin/nano-SiO₂ is lower than the epoxy resin/silicon powder's . So the different packaging material could be selected on the basis of different need.