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Electro-Thermal Effects Analysis Of Carbon Nanotube Bunlde Interconnect

Posted on:2008-08-28Degree:MasterType:Thesis
Country:ChinaCandidate:G FuFull Text:PDF
GTID:2121360242476803Subject:Electromagnetic field and microwave technology
Abstract/Summary:PDF Full Text Request
CNT (Carbon Nanotube), because of its excellent electronical and thermal properties, has attracted much attention of global researchers'since it was found less than twenty years ago. Due to its low resistivity and high carried current density, CNT has been viewed as the reliable material for the next generation interconnects. In this paper, we extract the equivalent distributed circuit model of a metallic SWCNT, and based on this model, the equivalent distributed circuit model of an M-M DWCNT is proposed. Then, the performance in time delay is made between SWCNT bundle and copper interconnect as well as DWCNT and SWCNT bundle interconnect. All the simulation parameters are refered to ITRS 2005 at different sub-45nm technology nodes, and with the help of HSPICE simulation it is shown that using SWCNT bundle interconnect can greatly reduce the time delay at intermediate and global interconnect levels. In addition, compared to the SWCNT bundle interconnect, the time delay can be improved further by using the DWCNT bundle interconnect. Finally, the analysis and comparion of self-heating effects between CNT bundle and copper interconnect are performed. It is shown that the suppression in temperature rise because of self-heating effect is significant when the CNT bundle is implemented appropriately, which indicates that using CNT interconnect can effectively alleviate the negative influence brings by thermal effects.
Keywords/Search Tags:Single-Walled Caron Nanotube (SWCNT), Multi-Walled Carbon Nanotube (MWCNT), Double-Walled Carbon Nanotube (DWCNT), Interconnect, Delay, Self-Heating Effects
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