| The materials with high performance of electronic borad are needed for the development of IC at a very high speed. The teconology of LTCC (low temperature co-fired ceramic) is suit for making high density substrates with passive components. Glass-ceramic material is adopted by the LTCC multilayer substrates, this kind of LTCC materials which has low firing temperature and adjustable coefficient of thermal expansion and fine thermal conductivity can realize the high density packaging.The primary coverage of this article embody the design and preparation of glass powder, the process of LTCC, the testing and analyzing of LTCC.This article describes the preparation of the CBS glass powder used for the LTCC material. The melting glass was spurted into the water to make glass powder. The melting temperature of the CBS glass powder was decreased by the addition of bismuth oxide, the glass powder with the aluminum oxides is infiltrated quite well with the aluminum oxide powder. The sintering temperature of LTCC is between 800℃～950℃.This paper describes the preparation of materials and the processing of LTCC, the system for the solvent organic class of ethyl alcohol and toluene is suitable to the LTCC powder, the method of liquid-drying may effective avoide the flaws of LTCC.The sintered ceramic thermal performance and mechanical properties were tested and analysised.The strength of flexure of BaCO3 based LTCC is bigger than 160Mpa, the strength of flexure of Al2O3 based LTCC is bigger than 200Mpa. The density range of BaCO3 based LTCC is 3.8～4.2g/cm3, the density range of Al2O3 based LTCC is 3.9～4.1g/cm3. The mean LTE of BaCO3 based LTCC is 8～20 ppm·K-1 with 100mN from room temperature to 500℃, The mean LTE of BaCO3 based LTCC is 6～10ppm·K-1. The thermal conductivity of Al2O3 based LTCC is during 4～10w/(m·k).The results conform to the requirements fundamentally.Finally, by generalizing the work, the further question which also will need to be solved has been taken out to analyse.
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