Bond Rolling Principles And Heat Treatment Of Cu/Al Clad Sheet

Within the domain of the family products, multifarious machines, transports and commodities, from the viewpoint of the saving energy and resource, the developing direction is reducing the weight of production and improving of capability and function. Therefore, it has more need to basis materials function such as Aluminum and Copper etc. Which is composed of one single material can't meet people's need any more. It's urgent for the new materials which possess some special abilities and functions. And Cu/Al compound material not only have the advantage of Cu such as good conducting electricity, high transmitting heat rate, low electric resistance and beautiful appearance, but also have the advantage of Al such as light weight and economy etc. With the rapid development of electric power, electronic industry and computer in recent years, the proportion of laminated materials used in wiring, instruments and electronic chipsets is notably increasing. The demands for the precision and stabilization of the material properties is also becoming more and more strict, thus need accurate control of the individual thickness and thickness ratio of the laminated materials. In conclusion, the study on the rolling principles of Cu/Al compound material is very important for not only the practical control of bond process, but also the basic theory of bond rolling.The author found that based on the whole factor orthogonal experiment of bond rolling with Copper and Aluminum, the effect of initial thickness, initial thickness ratio and reduction on the thickness ratio after bond was discussed. It shows that, if other factors are constant, the thickness ratio after bond will go up with the rising of initial thickness, initial thickness ratio and reduction. Based on rigid-plastic finite element method (FEM) theory, through the secondary development on DEFORM simulation platform, the FEM simulation of bimetal bond and double-bond was carried out with the similar condition of practical manufacturing. According to the contours of stress, strain and strain rate, the characteristic of bond process was discussed in detail.By the diffusion of atoms during diffusion annealing, it was found that the interface could not reach metallurgical bounding. Inter metallic compounds which deteriorate the bounding strength form with improving the annealing temperature, indicating that diffusion mechanism has no evident effect on Cu/Al rolling clad sheet. And the mechanism of Cu/Al roll cladding was analyzed. In order to satisfy the forming property (bending property), heat treatment of Cu/Al rolling clad sheet should be at a low temperature, especially at 350℃for one hour.