Study On Synergistically Toughening Epoxy With Organic And Inorganic Nanocomposite

Epoxy resin as a typical representative of the thermosetting resin has been widely used because of its excellent properties. However, the application of epoxy cured in the higher-requested fields is limited as its brittleness and poor thermal properties. In this article, the epoxy resin is synergistically toughened by rubber and organic clay on the basis of the summary on the present research results of epoxy resin in the domestic and overseas.Firstly, the best curing process of MeTHPA curing system is confirmed by the orthogonal experiment. Then, the influence of the type and content of the clay on the properties of composites was studied.The results show that the organic clay DK18 which the intercalation agent can take part in the curing reaction can enhance the composite materials properties and the best properties were obtained when the content of clay is 6phr. Compared with the pure epoxy, its impact strength, bending strength, bending modulus and heat distortion temperature are increased 22.65%, 18.11%, 26.63% and 7.8℃, respectively. The epoxy resin modified by organic clay DA have the best properties when the content of clay is 8phr. Compared with the pure epoxy, its impact strength, bending strength, bending modulus and heat distortion temperature are increased 31.81%, 12.96%, 10.36% and 13.1℃, respectively. On the basis of the above research, combining with the further research on rubber toughening epoxy resin, the role of the rubber and clay synergistic toughening epoxy resin was investigated. The results show that by using the reactive between the rubber and the DA organic clay, the epoxy resin material with higher performance can be obtained, which are better than ordinary clay and the rubber synergistically toughening epoxy resin. The optimal proportion of DA and CTBN is 100:8:15. The resulting epoxy/clay/rubber composites possessed higher mechanical and thermal properties. Its impact strength, bending strength, bending modulus and heat distortion temperature are increased 95.0%, 5.55%, 9.76% and 3.7℃, respectively.