Surface Tension Analysis And Pipeline Parameter Design On Selective Solder Wave

Based on the selective wave soldering, we carried out innovative research in electronic assembly technology to achieve fast, high-precision welding. Designed a new type of wave tube head through the first diameter of the welded pipe is set to carry out selective soldering for the components.Through theoretical estimation of a solder wave surface equation, and thus find the solder in the lumen and the exhaust flow when the speed of the spray pattern when the solder, as well as analysis of the force, set up with the PCB solder wave height, can be more effectively welded. Because of the special nature of solder material so that it has a certain thickness, and thus with the thin shell approximation, so use the elasticity of the non-torque theory, fluid mechanics, surface tension and slip-flow characteristics and physics of electromagnetic induction theory, in solving the parameters of a structure, the use of Matlab draw the electromagnetic pump to provide pressure and welding peak method to the relationship between displacement, determine the actual welding pressure electronic devices best value, in the pipe diameter with the electromagnetic pump for the relationship between pressure, after the pressure of the electromagnetic pump used in the design, because the pipe diameter is changed, so for the minimum and maximum pressure should be to provide stability between the peak pressure welding.The pressure needed to obtain the structure in the value of the existing induction-type electromagnetic pump based on the study design of a pass into the alternating current can be achieved only for the electromagnetic pressure pump, with high-precision tracking device, through the timely collection yuan feedback signal device models, and to choose pipe diameter to achieve the original intention of the original design.