The Preparation Of Epoxy Pouring Sealant With High Capability

In this thesis, at first epoxy resin E-44 was used as main resin, nano SiO2 was used as toughening and strengthen filler, and pouring sealant was prepared by silidified of aminal -105. Then we choose a proper dosages of curing agents and make surface treatment to nano SiO2 to got a high cost performance epoxy sealant; secondly AG-80 epoxy resin was used as the main resin, the reaction produce of carboxy terminal butadiene-acrylo nitrile (CTBN) and 1,6-Hexanediol diglycidyl ether was used as active toughening diluter, nano aluminum nitride which was surface treated was used as heat conductive fillers, this thermal conductive pouring sealant was also prepared by silidified of aminal -105. Using analysis methods as thermal gravimetric analysis, mechanical property testing, adhesion testing, aging resistance test, electrical performance test, thermal analysis and so on, mainly do the following four aspects of research:(1) Studied the effects of that nano-SiO2 was used as toughening and strengthen filler. When nano-SiO2 was used to toughening epoxy resin, the chemical bond formed with epoxy group and nano-SiO2 is much greater than the force Van der Waals forces, formed a very good interface. The good dispersion of nano-SiO2 can play a very good cause of micro-cracks in the role of energy absorption. It can make the epoxy sealant substantially increase the mechanical properties; and coupling agent KH-550 can make nano-SiO2 filler uniformity dispersed;(2) Studied the effects of the self-manufactured active toughening diluter in the AG-80 epoxy resin system. The comparison of the effects of the self-manufactured active toughening diluter and CYH-277 showed that: the self-manufactured active toughening diluter has better thermal resistance and mechanical properties than CYH-277, although in aspect of the bonding properties the self-manufactured active toughening diluter slightly lower than CYH-277, also has good adhesion.(3) Studied the effects of surface treatment of thermal conductivity fillers. Find that when coupling agent KH-550 was used to do surface treatment of thermal conductivity fillers ,the surface treated fillers has smaller volume of the settlement than fillers didn't do surface treatment, and coupling agent KH-550 can make thermal conductivity fillers uniformity dispersed; the pouring sealant added the fillers which was surface treated by coupling agent KH-550 has a higher thermal conductivity, It indicate that the thermal conductivity of the pouring sealant dominated by the extent of dispersion of thermal conductivity fillers, the more uniformity the thermal conductivity fillers dispersed the higher the thermal conductivity be.(4) Studied the thermal conductivity of the pouring sealants which are differently filled by nano AlN, micron AlN and micron SiC. Found that the same amount and thermal conductivity of fillers added, the pouring sealant filled with larger grain size of thermal conductivity fillers has better thermal conductivity; Also when the same amount and grain size of fillers the pouring sealant filled, the pouring sealant which was filled by the thermal conductivity fillers with higher thermal conductivity has higher thermal conductivity.