Study On The Electroless Copper Plating System Of Aluminum

Today the copper resources are growing scarce, but copper clad aluminum material, which becomes the third one in conductors after the copper and aluminum, is used more widely. It not only has the advantage of light weight, relatively low cost, price stability and so on, but also overcome the high cost of copper price fluctuations and other defects. As the special nature of aluminum, copper in the.aluminum body is very difficult, so that until now Electroless Copper plating Technology of Alumina layer on Aluminum Substrate is rare,but the electroless copper plating method, as a new production method of copper clad aluminum material, of which the advantage is very significant.A review is made on the mechanism of electroless copper plating. Some commonly used systems and their main components of electroless copper plating were introduced. There are some articles which have reported the replacement of form aldehyde as reducing agent, such as hypophosphite and glucose. At the same time, we are doing research about the hypophosphite as the reducing agent and Triethylenetetramine as the complexing agent:Electroless copper plating system of the hypophosphite as the reducing agent was in—vestigated comprehensively. The experiment confirms the best craft and dispensation of the electroless copper. The effects of pretreatment, composition of plating solution, temperature, pH and additives on electroless copper plating are introduced in detail.The results indicate that the copper deposition rate decreases with the increase of the concentration of TETA and plating time, and increases with the increase of the concentration of CuSC4·5 H2 O and hypophosphite, pH value and reaction temperature. Although the influences of 2,2'-Dipyridyl additives on the deposition rate are small. those of these additives on the surface qualities of copper film are great.The optimal conditions of the electroless copper plating system areas follows: CuSO4·5H2O is 8g/L, TETA is 10mL/L. NiSO4·6H2O is 2g/L,2,2'-(1t-Dipyridyl is 15 mg/L. .pH value is 9.0, reaction temperature is 70℃. Plating for 3 HOUR in the bath, the copper deposition rate reaches 6.429μm/h. the surface of copper film is smooth and fine.Simultaneity, the process flow diagram of electroless copper plating,and electroless copper plating at present and in the future are indicated.