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Numerical Simulation Of Light Alloy Component In Hpdc

Posted on:2011-09-25Degree:MasterType:Thesis
Country:ChinaCandidate:M Q YuFull Text:PDF
GTID:2121360308963477Subject:Mechanical Manufacturing and Automation
Abstract/Summary:PDF Full Text Request
HPDC process is invisible, quality could only be predicted and controlled base on experience and the general theory. With the development of computer technology, according to heat transfer theory, fluid mechanics and metal solidification theory, the numerical simulation of HDPC is used to predict and control product's quality, as well as be used to help optimize program by simulate the filling and solidfication process, temperature field, stress field, micostructure results and so on.In this paper, the 3-D gating model and FDM simulation model of a complex aluminum product were built. By virtue of simulation, the solidification process, the filling process and air entrapment condition were presented, and the positions of defects were predicted. The results of simulation were in good agreement of the product from the experimentation.In order to increase material utlization of a cell phone die casting product, traditional cone-shaped runner system, local-hot runner system and hot runner system were estabilished. Compared the simulation results of filling and solidfication process, particles tracing, temperature field and Niyama Paramater, the regions of defects were predicted. The conclusion of using hot runner can improve material utilization, reduce cold process, reduce gas intrapment, reudce solidfication time and increase efficiency. The results of simulation were also seen agreement with the results of experiment.In this paper, by virtue of simulation, the temperature distribution at each stage in filling process and solidification process was presented, the thermal stress distribution in solidification process was obtained, and the positions of crack were predicted. According to the results, an optimization model was estabilished. The results show that in HPDC, inconsistent solidification is one of the reasons causing tensile stress in the magnesium component. The results of simulation were in good agreement of the product from the experimentation.
Keywords/Search Tags:Numerical Simulation, Light Alloy, HPDC, Heat Runner
PDF Full Text Request
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