| Epoxy resin is a kind of thermosetting resin, it has good technology property,mechanical property and physical property. The waterborne epoxy resin can be used without volatile organic compound (VOC), meet the requirements of environment protection. Resent years, the study on the waterborne technologies of epoxy resin and its application have been a popular area which attract much attention.In this article, the system of the epoxy resin 669 has been studied at first, the mixture of organic solvent (the ethylene glycol ether) and deionized water was employed as the solvent for the system, the best ratio of organic solvent to deionized water was 1:1. The curing agent used in the experiment was triethylenete tetramine (TETA), which was put in self-control Lewis acid solution. The epoxy 669 curing system was confected, according to 40% the solid content and 17% of the quantity of curing agent. The stability of epoxy resin curing system under room temperature was studied. The hardening time of epoxy resin curing system under high temperature was studied. The epoxy resin curing system was analysed by TG. And the epoxy resin system in the area of adhesive was studied basically, the tensile and shear strength was tested. After experimental analysis, the application period of epoxy resin curing system under room temperature was found to be more than one week. The curing time at high temperature was also investigated to be within one hour, with a cure temperature of 95℃. After TG analysis, the initiative decomposition temperature of epoxy resin curing system was 240℃, the terminated decomposition temperature was 620℃. After the text of the tensile and shear strength, the average of the tensile and shear strength was 0.486 MPa.Secondly, according to the molecule design, a kind of modified resin which have both epoxy groups and hydrophilic groups was synthesized from diglycidyl ether type epoxy resin (669) and ethanolamine. After neutralized by acid, the modified epoxy resin could dispersed into water and a waterborne epoxy resin system with excellent stability was produced. The effects of the reaction temperature and reaction time was studied and the optimum condition of the synthetic reaction was determined. The reactive product was characterized by FTIR, the result show that the strcture of the modified resin was just the from what was designed firstly.Finally, stability of the modified 669 waterborne epoxy resin system was studied, and the waterborne system can be stored at room temperature for more than two months. The pot life at room temperature of the modified epoxy resin 669 curing system was also studied, which was found to be 1 week or so. The epoxy resin curing system was analysed by TG. The initiative decomposition temperature of modified epoxy resin curing system was 230℃, the terminated decomposition temperature was 620℃. The tensile and shear strength of modified epoxy resin curing system was tested, the average of the tensile and shear strength was 0.837 MPa. And it compared with the tensile and shear strength of epoxy resin curing system, it meant that the mechanical property of modified epoxy resin curing system was better than that of epoxy resin curing system. It explained that modified epoxy resin can give insights to further study. |
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