| Magnetron Sputtering has been developed as one of the most important technologies in industrial coating, especially for large area deposition.Magnet makes important roll in the process of magnetron sputtering.The strength and distribution of magnetic field determine the characteristics of the plasma,which affect the quality of film,etched area and the utilization of target.This paper main includes:We discussed the cause for uneven etched area,low deposition rate and ununiformity of the film and proposed the solution and methods to the problem.The design principles of strength, uniformity of the magnetic field and the structure of the magnets has been given in this paper.We can estimate the structure is reasonable or not according to the distribution of electromagnetic fields.We analyzed the influences of parameters on the magnetic field in target structure,including uniformity and intensity in both straight and end region through the finite element simulation,the influences of gap and defference between magnets on the magnetic field.We got results in the following:cutting angle of magnets can increase the parallel level of flux, the size of angle make tiny effect on the magnetic field but obvious effect on the strength;an optimized structure was achieved by comparing different width and height of magnet;iron installed on the magnet can reduce the bad influence on the magnetic fields distribution by the gap and difference between magnets; an optimized structure was designed and it was better than current one on both magnetic field intensity and uniformity in both straight and end area.New experiment was designed. Experimental results of similar structure from other scholars were used to validated my structure,which indicate the new structure can avoid the anomalous sputtering in current target and then increase the target life relatively. Furthermore, the way to increase the width of erosion area by optimized magnetic field is reasonable.
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