The Study Of Plasma Beam Sputtering System

Now Physical Vapor Deposition mainly includes heat evaporation, sputtering and ion plating. The appearance and application of sputtering technology come through lots of process such as diode sputtering, audion sputtering, magnetron sputtering and other novel sputtering system. The diode sputtering system has simple structure and can be controlled easily, but its plasma's density is low and the deposition rate is low because of its discharge structure. Compared with the diode sputtering, the magnetron sputtering system has higher deposition rate and lower temperature of its substrate. Since its magnetic field is the main factor of state of plasma, the asymmetry of magnetic field brings the instability plasma and low utilization target and others disadvantages.Beijing Leyfond Vacuum Technology Company Limited has manufactured the plasma beam sputtering system. There is not magnetron target in this system and there is a high density plasma source mounting in the side of the chamber. The experiment result that it has higher utilization target and stability plasma and it can controlled the grain size effectively.The plasma beam in the system is extracted from the plasma source, then transports in the chamber and sputters on the target under the effect of the electric field and the magnetic field. After we manufactured the plasma beam sputtering system, we analyzed the electric field and the magnetic field in the chamber using the electromagnetic module of the COMSOL Multiphysics, and we got the distribution of the electric field and the magnetic field. The electric field comes when the target was switched on with the negative deflection voltage, and the magnetic comes with the launch magnet and the steering magnet, they are independent with each other, and effect the plasma beam together.We analyzed the extracted beam stream of the high density plasma source through the decomposition of the plasma beam sputtering system and application of single particle orbit model., the plasma beam is extracted from the source by the launch magnet. The beam bombards the target and then sputters in the electric field and the magnetic field. We study the principle of the plasma beam sputtering system after the analysis of plasma's movement in the electric filed and magnetic field.