S- Type Runner Simulation And Fin Structural Optimization Of The Cold-plate

Thermal analysis is necessary in cold-plate designing. the key techniques of thermal simulation is studied In this paper. In this case of diverse runner and fins, it analyzes ability of heat dissipation to afford opinions that someone would choice the S-type cold-plate.First of all, according to power density of the chip, it choices fluid type cooling pattern, and builds the model of initial cold plate. Physical model and boundary conditions are analyzed in the whole system.Whereafter, on the basis of fundamental requirements and principles of thermal design, it designs runner structure and computers in numerical method, draws the best to meet the requirements of runner structure. The key techniques of PRO/E integrated WORKBENCH is resolved, builds CAD models of runner and fluid, exports information that they are fulfill with ICEPAK required file format.Finally, thermal performance of the optimal structure of the cold plate at different fins and inlet flow is researched, the influence of resistance in the elbow is analyzed. In order to understand how the runner structure is affected the thermal performance of the cold plate. In the case of the runner structure, number and structure of fins, chip power and inlet flow are variable, ICEPAK software would simulate temperature distribution, chip's maximum temperature, temperature and pressure difference of the import and export, analysis of how to temperature and pressure drop, optimize inlet flow and select the appropriate chip power, it provides valuable guidance to users in s-type and s-type adding fins runner.