| :In modern PCB production process, The realization of to make various holes (including components hole, via hole, etc)the metal, Plating is commonly used, the purpose of which is to make sure that these holes have good conductivity. For single plate or simpler double-layer plate, the usual DC plating is good enough to meet the requirements. However, with the development of modern power electronic technology, components are smaller and array development, the four and more layers PCB plate are getting more popular. A lot of holes and the small diameter become very common. These all together are challenging the DC plating.This paper is to use a new type of high-frequency bi-directional pulse plating power supply to replace the traditional DC plating power supply. In order to achieve better plating results, to meet the multi-layer, high-density copper PCB board requirements. In this paper, the principle of bi-directional pulse plating conducted in depth introduction, describes the advantages and necessary of bidirectional pulse plating power supply in modern electroplating industry. Meanwhile, through deep analysis, we found a very clever circuit topology, which can achieve high-speed switching and high current establishment. This paper focuses on the bi-directional high-power low-voltage high-current pulse electroplating power supply, In which one of the most important component is the full bridge converter, This article will detail description of its basic principle and design of the power.The system uses the TMS320F28335 of TI company as the core control chip, This paper Introduced a digital control method of the bi-directional pulse electroplating power supply on this chip, Simultaneously present a new way that how to produce shift phase pulses. On the theory above all, we take on experiments with plating power supply of 12V/1500A. Through analysis of experimental results, the new way has been proved true and practical.
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