Analysis Of Evaluation Method And Interface Bond Performance Of Chip Seals

Generally, Chip seals are applied to lower seal coat on new road construction, Stress absorbing Layer on bridge deck pavement and so on.Chip seals are used to enhance the binding propertiese,to seal surface against water intrusion,to stress absorbing between surface course and base course, While its advantages such as economy, and easy construction etc.As lower seal coat on new road construction, Bond status and materials application rates impact its service performance and lifespan seriously. Base on research findings above, This paper carry out study on evaluation menthod and interface bond performance. Principal research as follow:Firstly, According to material composition's property of chip seals and using abroad for chip sealing performance measurements. In this paper using new measurements to evaluate the performance of chip sealing, including Binder Cover Rate(S_e), Binder Discoverer Rate(C_a), Nature Aggregate Loss(TLL₁),and Moss Loss(TLL₂), While using method of regression analysis and grey relational anlysis, To prove available evaluation methods and corresponding indexes which has showed a good dipartite degree has also been proposed .Secondly, Design and manufacture skew shearing model for MTS 810 and test specimens model. Adopt finite element method to calculate and analyze development's process of shears in skew shearing test.Finally, The effects of different construction measures between surface course and base course, amount of different materials, different temperatures on the performance of the bonding performance, As evaluated by skew shearing experiment. The results demonstrate that chip sealing can enhance the interface bonding between surface course and base course, temperature effect observably on counter-shear ability and the determination of an optimum material consumption.