| Heat flux is difficult to measure especially transient heat flux, which has not been resolved until now. So the research and development of transient heat flux sensor fills the domestic gap of measurement of transient heat flux in some aspects. The sensor has an extensive prospect of industrial application in the construction engineering and aeronautics and space fields.Upon comprehensively reviews of the predecessors?results, using the experience of other countries for reference, and implementing thin film technology, the author have developed the microsensor in this thesis by sputtering metal material on a silex substrate. The temperature sensing layers each constructed of 28 copper and nickel thermocouples placed in series to form a differential thermopile. The thermocouple layers are separated by a thin layer of silicon oxide, which is the thermal resistance. It is nominally 38mm long by 22mm wide by 1mm thick. Advanced data acquisition and switch unit and computer technology are applied in the research. The sensor is calibrated, then the relative curve of heat flux vs thermal voltage is determined. Moreover, the test of responses of steady state and transient state has been done and the results are compared with predecessors?results, and proved to be advanced in response speed.The non-linearities of the calibration curve is primarily discussed. At the same time, the errors in the test of heat flux microsensor are analyzed, and some beneficial conclusions are drawn.
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