Experimental Investigation Of Thermalsiphon Radiator For Refrigerant R600a

With the developments of very large scale integration (VLSI) and high-speed large computers,the specific rate of heat flow increases rapidly. As the performance and power of each generation have increased,CPU developed from 386SL and 486SL,to DX2,to DX4. Especially the detrusion of Pentium IV,CPU strides forward to a spick-and-span times .And the power dissipation of CPU is higher than ever before and the process speed of CPU reaches as fast as billion. Thus maintaining CPU surface temperature at acceptable levels has been a challenging task in the realm of heat dissipation.This experiment focuses on the characteristic of green refrigerant R600a in a small parallel flow aluminum closed two-phase thermosiphon and measures all the quantity of injected mass and heat dissipation,the speed of air and the difference of temperature of the electronic element (CPU simulate chip) surface and environment. It shows that the injection quantity and the difference of temperature distribute as a parabola which is at the same load,and the minimum of the parabola corresponds to the optimum quantity of injection(G).Under the condition that the quantity of injected mass,the air speed and the heat quantity is respectively G,V and Q,the research demonstrates that the Pentium IV chip's temperature variation can be controlled under 40C and work normally when the wind speed overpass 1.5m/s and the power dissipation of the chip is 60w.Otherwise this paper calculates the flooding limit of thermosiphon with several different methods.