Numerical Analysis Of The Heat Transfer Character In The Evaporator Of Loop Thermosyphon With High Heat Flux

The generalization and sum on the history, development and present status of heat pipe are presented at first. The literatures about using heat pipes for heat emission on electronical devices especially on the CPU of computers are summarized.At first the problems should be simplified. Then the qualifying and right physical models for computing can be constructed. After the model is made, the Energy equations, Momentum equations and Continuity equations should be dispered for programming and computing. In the paper Gambit is selected for grid demarcation and Fluent of CFD Softwares is selected for numerical simulations. The analysis made on the heat transfer characters in the evaporator of Loop Thermosyphon is based on the temperature distribution of the bottom and top of the evaporator. During the computing course, Heat Power, filling ratio of liquid and Saturation Temperature are taken into account. From the temperature distribution the following conclusions are obtained: In the conditions of given size (Length X Width X Height, 65 X 65 X 15mm) the optimum filling ratio of liquid is 40% or so, the maximal Heat power is 160W and the smaller saturation temperature is in favor of the better heat transfer characters. After the average temperature of the bottom and top of the evaporator is got, the thermal resistance of each parts of the evaporator can be computed by using linking heat resistance model. Thus some measures of reinforcing heat transfer are advanced for the purpose of improving the heat transfer characters of heat pipe . The above works can be of some value for the design and optimizations of heat pipe.