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Experimental Study And Numerical Analysis On The Boiling Heat Transfer Of Loop Thermosyphon Heat Sink

Posted on:2006-04-30Degree:MasterType:Thesis
Country:ChinaCandidate:X F WangFull Text:PDF
GTID:2132360155463263Subject:Engineering Thermal Physics
Abstract/Summary:PDF Full Text Request
With the rapid development of electronic technology, the problem of heat sink, which is caused by high frequency and high speed of electronic apparatus, density of integration and miniaturization of integrate circuit, has become one of basic factors that restrict the development of electronic technology. And the study of heat sink technology of electronic apparatus becomes more and more important. Firstly, development and actuality of heat pipe heat sink are reviewed. Secondly, experimental study and numerical analysis on the boiling heat transfer of loop thermosyphon heat sink is conducted in this paper.Towards simulating electronic apparatus, an experimental equipment of loop thermosyphon heat sink on the heat transfer characteristic was set up, which is divided into heating subsystem, vacuum subsystem, measuring temperature subsystem, water pipeline subsystem and cooling subsystem. Experimental research on the heat transfer characteristic of loop thermosyphon evaporator has been conducted in the paper, the result shows: Under the condition of temperature of cooling water being same, heating temperature of the copper block rises with the increase of heat sink's power, and bottom temperature and liquid saturation temperature inside the evaporator also rises correspondingly, Change of each point temperature has a linear relation. The cooling ability of the condenser influences the saturation temperature of working medium in the evaporator. The result of the experiment quite accords with theoretic analysis, and it has certain dependability.In numerical calculation part, the heat transfer characteristic of evaporator in loop thermosyphon heat sink is analyzed and calculated. First, some basic suppose is given to simplify the question, and a suitable physical model is set up. Then, dispersing of energy equation, momentum equation and continuity equation, etc is carried on. Finally the numerical computation and analysis is conducted by Fluent software. The result shows: Mixture Model is a quite ideal model for the flow and heat transfer in the evaporator of loop thermosyphon heat sink. The power load of heating device has a significant contribution on the evaporator heat transfer...
Keywords/Search Tags:Electronic apparatus, Loop thermosyphon, Evaporator, Heat sink'power, Saturation temperature
PDF Full Text Request
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