Design And Simulation Of Pre-bonding System Of Flip Chip Equipment For RFID Packaging

The pre-bonding system, the key component of the RFID packaging equipment, is designed, analyzed and realized in this thesis. The main function of the system is that the chips are picked and placed on the pad of the antennas using flip chip technology to realize the electric and mechanic connection. The performance of the pre-bonding system directly affects the quality of the RFID tag.The whole configuration of the system is analyzed. It consists of four machines: chip-feeder, flip-head, pick-and-place head and X-Y gantry. A multi-nozzle rotating head is designed. A scheme of this system which can satisfy the efficiency requirement is proposed.Because of the intervention of the machine in the work space, the kinematics simulation of the chip packaging procedure is implemented in the Deneb/Envision software environment. The motion sequence of the system is designed according to the simulation result in order to achieve the high efficiency of the production in the case of avoiding collision. In addition, the minimum acceleration of the two flip-heads that doesn't affect the efficiency of the equipment with one chip-feeder is calculated out.Timing belt position system is used in the pre-bonding system. To research into the vibration of the timing belt, a simplified model of the timing belt position system is built. The simulation result of the model is compared and analyzed with the experiment in this dissertation. In the simulation, vibration appeared in the acceleration curve when a step force is loaded.To overcome the complexity of the control system and the lack of hardware resources used in team developing environment, a method by which the control code in the simulation system can directly migrate to the operation system is proposed. Based on components methodology, the prototype has been developed.