A Study Of Metallization Technology Without Pollution Of Ferrite Creamic

With the fast development of the electronic industry and the requirements of high electromagnetic compatibility, ferrite ceramic has been widely applied due to its high-frequency characteristic. As the crucial technique of the electronic ceramic production, metallization technology has become one of the most hot international research subjects.Magnetron sputtering can improve the metallization quality and reduce costs. Furthermore it can solve the pollution problems of the traditional techniques, and reach the new EU environmental standards. All these advantages would make it to become a major field of the metallization. However, only a few of researches have been conducted in this field and little breakthrough has been made so far.Properties of metallization films and preparation techniques by sputtering were studied in this paper, and Cr/Ni-Cu/Ag films with better properties had been successfully prepared at room temperature. We also studied the influence factors of the film properties, the application of the film on 95% Al₂O₃ ceramic and the industrialization of this technology.The major work and innovation in this paper are as follows:1,Analysis the current developments and existing problems of the metallization technology of ceramic through literature reading. Theoretical study suggests the main factors of the metallization quality are the film's adhesion and internal stress. The film structure and sputtering parameters have a very serious impact on the adhesion and internal stress.2,To solve the binding and high-temperature welding problems, design the structure and each layer of the metallization film as Cr/Ni-Cu/Ag base on both theory and experiment. Besides replacing Ni with Ni-Cu as the barrier layer got good results. Until now, no investigation of this kind of technique has been reported, but it has great significance in both theoretic and application fields.3,We prepare metallization film on ferrite with magnetron sputtering, study the influence to the binding and high-temperature welding properties of the film thickness and the sputtering parameters in order to obtain the film structure, thickness and process parameters which are the best and most conducive to the industrialization respectively. The coating process use multi-target sputtering technology for a one-time deposition multilayer, which not only improve the quality and efficiency, but also reduce the costs. It is good for the technology's further industrialization.4,We analyze the surface morphology, section structure and solder corrosion situation of the best film Cr (150nm) /Ni-Cu (460nm) /Ag(300nm) by SEM. The bonding force and high- temperature welding probability of the film is up to 6.23MPa and 100%, which is higher than the traditional technology such as electroplating.5,Study the application of the metallization film on 95 % Al2O3 ceramic, discover the best film structure Ti(100nm)/Ni-Cu (680nm)/Ag(300nm) with bonding force and high- temperature welding probability up to 12.21MPa and 100%,which is also higher than traditional technology.6,Resolve the practical problems of the technology for its future large-scale industrialization base on study in laboratory, including the design of mask mold, comparison of sputtering and evaporation process, continuous sputtering production idea, and so on.