Ultrasonic Bonding System Applied To The Package Of Polymer Micro Parts

With the development of MEMS technology, polymer is used in the manufacture of micro parts. Polymer has good biocompatibility .The price of polymer is cheap, and the species are very abundant .The micro parts can be produced in batch by the method of micro injection etc.. At present the polymer micro parts were applied in bio microsystem ,such as micro fluidic chip,micro valve,micro pump,micro liquid storage container etc. It was important to package these micro parts with microchip.In this paper, considering the structure of micro parts and package requirements, a bonding system was developed, with the heatproduction principle of ultrasonic bonding. The ultrasonic bonding system contained three units: bonding control unit, bonding execution unit, detection unit., and the device designed was a typical mechanical-electrical integration system. In this system parts are bonded by the ultrasonic with frequency of 60 kHz and amplitude of 3μm. Linear movement system driven by step-motor is used for bonding pressure and feed control, and the bonding process accurately detected by inductance sensor and pressure sensor.Based on LabVIEW, control software had been compiled. The software included motion control, time control and the function of data collecting, analyzing, displaying, storing. The real-time monitoring of bonding process was realized by the software.The experiments had been done by using the welding system, and the results showed that the welding system had completed the package of polymer micro part well. The developed system provides an effective means for the package of micro polymer parts, which has high theory significance and practical values.