Research On Temperature Field Of Switchboard Based On Finite Element Method

The paper first briefly introduces the reason that the distribution cabinet causes heat, the influence of temperature rise on the normal work of distribution cabinet and the study situation of distribution cabinet's heat. On this basis, lead to the study of the subject–the question of distribution cabinet's temperature rise.Put forward the concept of distribution cabinet's temperature field against the temperature rise of distribution cabinet. Introduce three ways of heat transfer-thermal conductivity, thermal convection and thermal radiation, and heat flux equation. Introduce the hot differential equations of a steady-state temperature field, boundary conditions and the finite element method.Furthermore, expound the mechanism of distribution cabinet's heat transfer. Set up complete sets of low-voltage switchgear equipments of typical CGHL (K)-C-type products and the simplified thermal analysis model of 8E drawer unit. Analyze the research object of thermal load and boundary constraint conditions. Based on the national standards of temperature rise, test the temperature rise of the drawer functional unit of the CGHL (K)-type out-type low-voltage switchgear, and collect the temperature of the predetermined node through thermocouple. Prepare the material property of the thermal analysis calculation model, thermal load data and ambient temperature data.Finally, build the three-dimensional entity model of the drawer function unit, analyze the temperature field of drawer unit with ANSYS software, and compare calculated data with measured data. It indicates: in this paper, the results of the analysis methods are accurate. This methods are used for the thermal design of distribution cabinets, it will be helpful to improve the design efficiency, and reduce test costs..