The Performance Analysis And Experimental Study Of The Air Cooling Semiconductor Refrigeration System

This thesis first analyzed the semiconductor refrigeration basic principle and carried on analysis computation to the semiconductor refrigeration installment under the different active status thermal energy. The theoretical analysis to the semiconductor refrigeration installment performance influence was carried on which in connection with the installment cold end and hot-side temperature difference ,the thermoelectricity material figure of merit coefficient and the radiation performance of the radiator.That has established the rationale for the semiconductor refrigeration product development design and the existing semiconductor refrigeration installment performance test.And then a semiconductor refrigeration product of two-dimensional calculation model was established using ANSYS software products for the refrigeration space temperature distribution in a numerical simulation, and analysised the impact of convective heat transfer coefficient and TEC cold side of the refrigeration space placement. The improvement method to the semiconductor refrigeration product structure was proposed for the temperature distributes non-uniform as well as the temperature decrease speed slow question.One air cooling semiconductor refrigeration products prototype was designed which based on the numerical simulation results. Finally this thesis studied cold and hot-side heat transfer conditions on the prototype performance, and carried on the performance test and the experimental study to the prototype. The performance of the prototype testing and experimental results showed that the impact of laws and numerical simulation results, a prototype at the ambient temperature at 20℃still be able to maintain and the ambient temperature of 9℃temperature difference between the past, the design was basically a prototype which is scheduled to meet the requirements.