Thermoelastic Stress Analysis Of Thermoelectric Devices And Experimental Measurements On Its Properties Under Electric Or Magnetic Field

Recently, global environmental degradation and energy crisis are threatening long-term stable development of mankind. Governments of many countries have given more and more attention and support on green technology research and utilization. Thermoelectric cooler is an energy conversion device without chemical reaction, having wide application for no noise, small size, easy to move and long life. To improve the cooling effect thermoelectric cooler, attentions should be taking on exploring materials with higher thermoelectric properties and optimizing thermoelectric cooler structure rational.In order to optimize the structure of thermoelectric cooler and avoid material deformation because of too much stress, this paper takes thin film thermoelectric cooling device for example, making corresponding thermal analysis firstly. Then establish a bending thermal elastic stress model to analyze the thermal elastic stress state of thermoelectric film material. Finally analyzes the influence of thermal elastic stress under different factors. Taking into account the thermoelectric cooling devices often work in the aerospace, deep-sea or other special circumstances which will be subject to natural electromagnetic fields. To verify the influence of external electromagnetic field on cooling effect, this paper constructs the experimental platform and sisterly tests the cooling performance of thermoelectric cooling device in external electric field or magnetic field environment.