Study Of Practically Advanced Assembly And Packaging Process Manufacturing Technologies Of MCM-C

Depending on the now available process facilities of East China Institute of Photo-Electron IC and combining with the author's actual scientific research work, this paper studies the advanced assembly and packaging process manufacturing technologies of LTCC type Multi-Chip Module (MCM-C) in engineering practicality.On the basis of the summarization of MCM-C's main features and its assembly and packaging technologies, the paper puts stress on relatively deepgoing studies in practically advanced MCM-C assembly process technologies as gold ball wire bonding, IC chip gold ball stud bump making, IC flip chip bonding and underfilling, in high reliability MCM-C packaging process technologies as integral LTCC substrate packaging (ISP), hermetically metal sealing, and also in the basic technological process of MCM-C assembly and packaging. Later on, it presents the effectively engineering development of two high level actual module products--a high-density monolithic processor system MCM-C , a high-speed data collecting and processing system MCM-C. Lastly, it briefly introduces various common methods of quality inspection and reliability test of MCM-C assembly and packaging in engineering practice.The MCM-C assembly and packaging process technologies this paper developed are very practical, comparatively advanced and strongly characteristic, and the technologies can be reliably and effectively applied to the high performance integration of military microelectronic products.