Research On Packaging Technology Innovation Of Mobile Device Processing Chip Based On Copper Clad Laminated Flip Chip Technology

With the rapid development of wireless internet, the demand of mobile devices is growing fast. These mobile devices include smart phones, entertainment system in car, tablet PCs and e-books. If we only count the China smart phone market, it grew41%in2011as much as42million sets comparing to2010. In every of these mobile devices, there is an AP (application processor) working same as the brain in human body. This AP contributes most of the performance of the system, and also it has heavy factor in terms of the cost of the system. If we look at the manufacturing cost, we find that with the advance tech node using by the AP, the assembly cost becomes higher because we have to use high cost FC (Flip chip) package. In this paper, we are mainly based on using an innovative plated copper stud on chip I0(input and output) pads as the physical connection between chip and package substrate to accomplish a package design and manufacturing for an advanced AP IC. Such bump structure should not only allow electrical signal go through rapidly, and it needs to support a certain mechanical stress as well. We also discussed the advantage of this copper stud bump structure in terms of cost and chip design feasibility. We defined the copper stud bump design rules and the bumping process integration with testing and assembly.In the beginning of the paper, we introduced the scope of this paper is focusing on the package of mobile application processor. Then in the second Chapter, we elaborated for the FC package and discussed why the FC package becomes more and more important now a days. In Chapter Three we inferred how the copper stud bump can satisfy us in terms of design feasibility and cost. In chapter four, we showed that based on the theories in previous chapters we designed the experiments to verify the characters of the copper stud bump with high end wafer technology, and we discussed the new application as well such as using copper stud bump to build the mini thermal pump. Later in Chapter Five, with all theoretical copper stud bump for FC package being verified, we started to kick off the real AP products project, including determine the specific project objectives, confirming the member of the team and making the team task allocation, risk management, and implementation plan. Finally we showed the actual results of the project.This study has broken through the traditional packaging limitations. It provides ideas for the better package method for specified AP devices with verification data. It also could be a solid reference for the non-AP devices package selection.