| The electrical engineering manufacturing is the traditional industry of Hebei province. Much of its related test instrument depends on import. The development of the electrical engineering industry is restricted because it is expensive. The emergence of the virtual instrument caused the radical change in the auto and control realm of the electronics measure instrument, in opposition to traditional instrument, the virtual instrument has incomparable advantage. This problem-team set about developing virtual instrument on testing electrical engineering parameter based on the USB of data collecting board after analyzing domestic and international research situation. This thesis is finished based on developing a function mold of that system-the high-speed data collect board unit.For carrying out the high-speed data collection of the test virtual instrument of the electrical engineering parameter, the high-speed collection unit of this system is composed of the A/D conversion machine, Single Chip and bus interface. Because the adoption of USB connection, carrying out the characteristic of plug-and-play and hot to put or pull out. In addition, USB interface can also allow reach to 127 interface machines to serially connect the same equipment of PC, USB2.0 deliver speed can attain 480 Mbps. And the CY7C68013A is not easy to hot, in the meantime, this system can link four MAX125s in the same time, extending the conversion passage. Such design is much more satisfied the request of channels and also raising the conversion velocity consumedly, and adopting the GPIF mode of the chip to design and program, simplify the hardware design. It realized the data transport through writing internal single slice procedure and passing by to adjust to try. Each part of the experimental board works normally through test.The thesis is expatiating on the measure of the electrical engineering parameter, the constitute of the system of the data collects unit and work principle etc. carried on a research on the design both the software and hardware. The contents covered the measure of the electrical engineering parameter, USB2.0 agreement, development technique of GPIF according to the CY7C68013A chip and the electrical engineering parameter collected. This work was supported by the Natural Science Foundation of Hebei province. No.F2006000101... |