| With the great development of electronic information technique, RFID technology is widely expanded in many areas such as logistics trades. The expansion shows the excellent properties of electronic tags, which makes people be on the tiptoe of expectation for the spread use. At the same time, the R&D and manufacturing technology of electronic tags have been the chokepoints that limit the decrease on the production cost.Based on the Anisotropic Conductive adhesive Interconnect and Packaging Technology, a set of temperature control system for RFID (radio frequency identification) tag packaging is designed, as well as the PID algorithm experiment.Based on the comparing of the properties of three temperature sensors (thermocouples, platinum resistance, thermal resistance), PT100 is chosen for the control system. According to its temperature property, two correction programs is proposed against the non-linear characteristic. Errors of this two programs are given. Finally the high degree of linearity temperature transmitter is got.According to the control requirements, temperature control program that can control 64 bonders is designed. The MCU circuit, driving circuit and memory circuit diagram are designed, and also the mapping of PCB. Anisotropic Conductive Adhesive temperature measurement problem is settled using measuring surface temperature.Identified the control object, the PID control parameters are got by Matlab software. The result is verified and compared using experimental method. The ultimately control algorithms and parameters are got. I hope this may provide some useful guidance for the follow-up research and similar production on equipment development.Finally, last chapter summarize the results of this research paper, " temperature control system on Bonding System of RFID Packaging equipment ". Meanwhile the existing problems and the next research directions are given. |
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