The Advance Process Of Solving Aluminum Corrosion In 90NM And Less Than Etch

With the development of semi-conductor technology, the technology of semi-conductor manufacture had entered into 45nm generation form 90nm generation. And the 32nm generation has started to research and apply. Aluminum line has been applied from the earliest semi-conductor. The application of Copper line is less than 8 years. With the increase of Copper line application, the application of Aluminum has been decreasing. But Aluminum interconnect has existed for a long time, to match the method of Bonding technology. The Aluminum ETCH is absolutely necessary. One of the most important defects is Aluminum corrosion.The topic researches into the problem that the Aluminum corrosion in 90nm and less than 90nm Aluminum ETCH. Improvement of Dry ETCH process as the main means, and the improvement of the whole Aluminum ETCH flow as accessorial means. We want to get effective solution of Aluminum corrosion defect.