| Magnetic field plays a vital role in the process of Magnetron sputtering.The size and distribution of the magnetic field intensity determine the characteristics of the plasma, and has a great influence on the film quality, uniformity of etching and target utilization. The temperature of the target also directly related to the magnetron sputtering power and sputtering efficiency, and the quality of the cooling effect will also impact on the sputtering process. People studied by experimental methods in the past,which have high cost and long cycle.Therefore, the computer simulation and then optimize the experimental demonstration on related topics has an important academic and practical value.First, designed a0150mm circular planar magnetron target for JPG800magnetron sputtering machine. In order to make the horizontal magnetic field distribution as evenly as possible, used ANSYS finite element software to simulate and optimize the magnetic field distribution above the target surface. A total of three kinds of optimization model were put forward in this paper:Magnet diameter0180mm chamfered and with a guide-disk at the outer flank. Magnet diameter0150mm chamfered. Two sets magnet diameter (?)150mm. By changing the parameters of inner cylinder radius, the thickness of outer magnetic ring, the hight, coercive force, relative permeability and chamfering size, to achieve magnetic field uniform distribution areas are respectively20mm to69mm,18mm to58mm and18mm to57mm far from the target’s-center, and respectively account for77.5%,54%and52%of target area. Finally selected and processed the dual-magnet model.Secondly, experimente the dual-magnet circular planar magnetron target. Through the "mi" word and concentric circles method to measure its magnetic field, but the measured value compared with the value of simulation and optimization has a large error. Magnetic flux density is only60%of the optimal design and magnetic field distribution uniform area is only66%of the simulation optimization. The magnetron sputtering target was used for etching experiment with a (?)150mm×5mm aluminum target stuff and found that the target utilization is only17.76%. Through comparing the etching experiments with same size regular circular planar magnetron target, it was found that target utilization increased4.73%than the common one. In the cases of the manufacturing precision is only more than60%of the optimization and simulation requiremt, the target utilization still improved, which can fully explain the feasibility and superiority of the dual-megnet target.At last, simulated and optimized the water cooling system of SD500magnetron sputtering coater system with FLUENT software. Simulated the convection heat transfer of the target and found that the cooling water temperature between the inlet and outlet, the temperature distribution of target surface, state of the cooling water flow in the target all met the theoretical value and the actual measured value.Then optimized the depth, position, chamfering and so on parameters of the inlet and outlet cooling water pipes. It was found that the effect of the inlet cooling pipe to target is not obvious, while the outlet pipe parameters have a certain effect on target cooling. One of the most obvious effects is the depth that the outlet pipe into the target chambe. When the outlet pipe length is12mm in depth of the target chamber, the average temperature of high temperature area is30℃lower than the original one. This is because the distance between the outlet pipe and target suface was bacoming smaller, the cooling water gathered there to make the temperature lower. At the same time, this research slso demonstrated that the FLUENT software can be used in water-cooled system simulation and optimization of magnetron target. |
PDF Full Text Request