Deveopment Of Spray Plating Mechanism In Ic Lead Frame Part Silver Plating Product Line

IC lead frame is a main sort of assistant materials during the IC manufacture process. It is the groundwork for installing chips, offering leads for jointing. Lead frame’s bonding area is currently pressed mark, silver electroplating for ensuring bonding performance of package technology. In this way, we can get a very complanate bonding area for chip.It is required a very high finished product rate and reliability because part electroplating on lead frames is a key procedure in IC package. Namely the quality of plating-layer is required according with the need of packing and bonding.This dissertation introduces the key component-part plating equipment on the basis of development of IC lead frame part silver plating product line. It mainly analyses the key part of the part plating equipment,namely spray plating set which affects the quality of the plating-layer. It also analyses and solves the flow field parameters of spray plating set by using advanced software-Fluent. The structure design factor of affecting plating-layer quality is found.The improvement for the spray plating set is proposed by analyzing the velocity, flow path, pressure of plating solution in it. Experiments verify that the amelioration improves the uniformity and ensures the quality of the plating-layer.