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Study On Preparation And Properties Of Epoxy Resin Packaging Materials In Deep Sea

Posted on:2015-11-20Degree:MasterType:Thesis
Country:ChinaCandidate:C X WangFull Text:PDF
GTID:2181330431464651Subject:Materials science
Abstract/Summary:PDF Full Text Request
Epoxy resin by having good manufacturability, low shrinkage, high adhesivestrength, dimensional stability, chemical resistance, a good bond ability with varietyof materials, and other advantages has been widely used as a raw material forpreparation of packaging materials. As a packaging material, mechanicalproperties,water absorption,and compatibility with other base materials research areone of the main concern areas in recent years.In this paper, choosed epoxy resin E-44and low molecule polyamide as one system.Through calculating theoretical properties and testing mechanical properties,determined the best mass ratio of epoxy resin and curing agent of low moleculepolyamide was1:0.8. By measuring the DTA curves with different heating rates,usingthe method of T-extrapolation get the optimum curing process of system:68℃/1h+95℃/1h+108℃/1h ladder warming mechanism. To further shorten the curingtime, joined promoter suburbs2,4,6-III (dimethylamino) benzene (DMP-30) into thesystem, from the curve drawn by DTA tests,we can get the participation of DMP caneffectively reduce the glass transition temperature of this system and significantlyincrease the mechanical properties. After joining the DMP of10%, shear andcompressive strength up to16.2MPa,86.3MPa respectively. Plasticizer butylphthalate (DBP) added into the epoxy resin system, in order to improve the brittle andmechanical properties of this system. Shear and compressive strength from15.6MPa,68.3MPa up to20.2MPa,86.49MPa respectively with the mass of DBP was15%.In order to further improve the application of packaging materials in oceanenvironment faced by poor water resistance and compatibility problems with thesubstrate, this article through adding inorganic particals to improve materials’ separately, get composites with different content of inorganic particals. Study theproperties of composites such as shear and compressive strength, water absorption,mechanical properties of composites after placed in water bath for one day and CTE.Result showed that composite water absorption decreased both in low and hightemperature condition with activated inorganic powder. Mechanical properties ofcomposite increased with the increasing of inorganic powder, compressive strength upto115.4MPa、110.0MPa, shear strength were20.7MPa,20.5MPa respectively whenthe mass of microglass and SiO2respectively were8%. The addition of microglasscannot effectively reduce the water absorption of composites. At the same time, theaddition of SiO2can effectively reduce water absorption, under normal pressure,water absorption of composite decreased to0.02%from0.1%which was waterabsorption of epoxy. In high pressure, composites water absorption decreased to0.05%from0.17%which was water absorption of epoxy. Joined SiO2can alsoeffectively reduce water absorption of composite which placed in water bath for longtime.At the same time, the addition of inorganic particles, can effectively slow downthe reduction of mechanical properties after placed in water bath for24h. Siliconpowder can effectively reduce the thermal expansion coefficient of composites,improve compatibility with other substrates.This paper not only discussed the role of addition in improving mechanicalproperties as well as the affection of thermal properties of epoxy resins, also exploredthat the SiO2played a prominent role in water absorption, mechanical properties ofcomposite materials, and thermal expansion coefficient.
Keywords/Search Tags:epoxy resin, microglass, SiO2, water absorption, coefficient ofthermal expansion
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