Font Size: a A A

Synthesis And Characterized Of Phenolic Aldehyde Epoxy Resin Containing Dicylo-Pentadiene And Its Cured Material

Posted on:2008-11-12Degree:MasterType:Thesis
Country:ChinaCandidate:Q P YuFull Text:PDF
GTID:2181330434975471Subject:Applied Chemistry
Abstract/Summary:PDF Full Text Request
Four phenolic formaldehyde epoxy resins containing dicyclopentadiene (DCPD) were prepared. They are:phenol formaldehyde epoxy resin(DPNER-1), ortho-cresol formaldehyde epoxy resin(DPNER-2), p-tert-butylphenol (DPNER-3) epoxy resin and naphthol formaldehyde epoxy resin(DPNER-4).The preparing process including3steps:the reaction to prepare dicyclopentadiene-phenol resin(DPR) was carried out by using Lewis acid catalyst phenol, ortho-cresol, p-tert-butylphenol, naphthol separately react with dicyclopentadiene; then the dicyclopentadiene-phenol formaldehyde resin was prepared by using DPR react with formaldehyde(DPNR); the dicyclopentadiene-phenol formaldehyde epoxy resin(DPNER) was prepared by using DPNR react with chloroepoxy propane. The reaction condition was optimized,especially including ratio of reactant, the temperature of alkylation reaction and the period of reaction. The structures were characterized by GPC,FT-IR. The epoxy value and relative molecular weight and other natures were tested. Using MeHHPA and651as curing agent the curing process and the physical properties were investigated.It was found by studying that the better temperature was180℃by using MeHHPA as curing agent by DSC,the better temperature was75℃by using651as curing agent. Compared with epoxy resin E51, Tg was rised,at the same time, degree of hardness, corrosion resistance and water absorptivity of the cured material was improved.
Keywords/Search Tags:dicyclopentadiene, Synthesis, epoxy resin, curing
PDF Full Text Request
Related items