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The Studies On Preparation Proess, Structure And Properties Of Silicon Carbide Particle Reinforced Aluminum Composites With High Volume Fraction For Electronic Packaging

Posted on:2012-11-24Degree:MasterType:Thesis
Country:ChinaCandidate:M R ZhuFull Text:PDF
GTID:2181330467976378Subject:Materials Physics and Chemistry
Abstract/Summary:PDF Full Text Request
The silicon carbide particle reinforced aluminum composites with high volume fraction have a variety of outstanding properties for use in electronic packaging, such as low CTE, high thermal conductivity and low density. The preparation proesses of this kind of composites has became the hot topics in this area so as for making it more match with electronic components. The paper analysises the preparation proesses of silicon carbide particle reinforced aluminum composites with high volume fraction completely based on electronic packaging. And the paper thinks Extrusion casting, Mixing casting and Pressureless infiltration all could be the preparation for industrial production without considering the cost. But Pressureless infiltration is the best one of making the composites for electronic packaging because of the outstanding properties and the low cost, and also it needs to be improved in somewhere. The paper also thinks the best structure should with closed interface, have no defects such as pores and the SiC should be widely distributed.Analysise of all kinds of preparing technique, the paper expounds that the extrusion casting, the mixing casting and the pressureless infiltration all could be the preparing technique of Al/SiC composites without considering cost. But combined with the cost, the pressureless infiltration is the best preparing technique of Al/SiC composites for electronic packaging, and it also should be improved. Combined with the microstructure, CTE and heat conductivity of Al/SiC composites reseached, the paper thinks that, the microstructure of this composite should be as follows. SiC particles should be evenly dispersed within the Al matrix, and it should have a good bonding with the Al matrix, also there should have no flaws in material.By three characterization methods, the paper analysises Al/SiC composites with good perfprmance from abroad, and the SiC particle of Al/SiC composites volume fraction is55%. Result of XRD shows that the matrix alloy is Al-Si and the reinforcement is SiC particle. And from the result of TEM the paper gets that it is prepared by two sizes of SiC particle, one is about90-100μm and the other is about10μm, and there are evenly dispersed within the Al matrix. According to the analysis of SEM, the SiC particles have a good bonding with the Al matrix, the fracture mechanism of the SiC particles is cleavage and the the fracture mechanism of the Al matrix is ductile, these properties of microstructures provide a reference standard for the subsequent related research and production of Al/SiC composites.
Keywords/Search Tags:electronic packaging, Al/SiC composites, high volume fraction, preparationproess, microstructure, phase constituent
PDF Full Text Request
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